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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

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    Buy cheap Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 from wholesalers
     
    Buy cheap Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 from wholesalers
    • Buy cheap Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 from wholesalers
    • Buy cheap Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 from wholesalers

    Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

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    Payment Terms : L/C, T/T
    Delivery Time : 12-14weeks
    Brand Name : Xilinx
    Model Number : XQV300-4BG352N
    Price : Negotiable
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    Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

    Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352


    Descriptions of Aviation Parts :


    The QProTM VirtexTM FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex family comprises the four members shown in Table 1. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market. Refer to the "VirtexTM 2.5V Field Programmable Gate Arrays" commercial data sheet for more information on device architecture and timing specifications.


    Features of Aviation Parts:


    Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range to +125°C) Ceramic and Plastic Packages Fast, high-density Field-Programmable Gate Arrays Densities from to 1M system gates System performance to 200 MHz Hot-swappable for Compact PCI 16 high-performance interface standards Connects directly to ZBTRAM devices Four dedicated delay-locked loops (DLLs) for advanced clock control Four primary low-skew global clock distribution nets, plus 24 secondary global nets LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register Configurable synchronous dual-ported 4K-bit RAMs Fast interfaces to external high-performance RAMs Dedicated carry logic for high-speed arithmetic Dedicated multiplier support Cascade chain for wide-input functions Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset Internal 3-state bussing IEEE 1149.1 boundary-scan logic Die-temperature sensing device


    Specification of Aviation Parts :


    Mfr Package Description

    PLASTIC, BGA-352

    REACH CompliantYes
    StatusDiscontinued
    Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
    Combinatorial Delay of a CLB-Max0.8 ns
    JESD-30 CodeS-PBGA-B352
    JESD-609 Codee0
    Moisture Sensitivity Level3
    Number of CLBs1536.0
    Number of Equivalent Gates322970.0
    Number of Inputs260.0
    Number of Logic Cells6912.0
    Number of Outputs260.0
    Number of Terminals352
    Operating Temperature-Min-55.0 Cel
    Operating Temperature-Max125.0 Cel
    Organization1536 CLBS, 322970 GATES
    Package Body MaterialPLASTIC/EPOXY
    Package CodeLBGA
    Package Equivalence CodeBGA352,26X26,50
    Package ShapeSQUARE
    Package StyleGRID ARRAY, LOW PROFILE
    Peak Reflow Temperature (Cel)225
    Power Supplies1.2/3.6,2.5
    Qualification StatusNot Qualified
    Screening Level38535Q/M;38534H;883B
    Seated Height-Max1.7 mm
    Sub CategoryField Programmable Gate Arrays
    Supply Voltage-Nom2.5 V
    Supply Voltage-Min2.375 V
    Supply Voltage-Max2.625 V
    Surface MountYES
    TechnologyCMOS
    Temperature GradeMILITARY
    Terminal FinishTin/Lead (Sn63Pb37)
    Terminal FormBALL
    Terminal Pitch1.27 mm
    Terminal PositionBOTTOM
    Time@Peak Reflow Temperature-Max (s)30
    Length35.0 mm
    Width35.0 mm

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